The conductive packing increases the dielectric constant

The dielectric constant of a material can be significantly increased by the addition of conductive fillers, especially when approaching the percolation threshold.27

Conductive fillers, when added to a composite material, can greatly enhance its dielectric constant. This increase is particularly notable as the filler content approaches the percolation threshold, a critical point at which the composite's electrical conductivity increases dramatically. The dielectric constant can be increased from 20.8 to 39.1 at a filler content of 30 wt%, as compared to randomly aligned films2. This increase in dielectric constant is crucial for various electronic applications, including energy storage and thermal management, where high dielectric constants are beneficial9. However, it is also important to balance this with other properties such as thermal conductivity and dielectric loss to ensure optimal performance in electronic packaging applications38.